NanoVia Targets Wafer Scale Technology

The optical system is capable of processing material within a vacuum or purged environment to minimize recasting of debris formed when drilling occurs, and is offered with integrated micro viewing of various transparent films using a NanoVia designed contrasted interference based microscope imaging system. NanoVia is pursuing partnership and Joint Venture opportunities with semiconductor tool builders in the United States, Taiwan and Japan.

NanoVia has always positioned itself in growth market areas, and the growing needs of the wafer scale packaging market were anticipated at the beginning of product development in 1999. NanoVia expects market expansion in wafer level flip chip designs by domestic producers of high value added custom ASIC, memory, processor and system on a chip products, for such applications as optical detection, inertial navigation and optical communications for military products, all of which will ultimately drive the commercial consumer marketplace.

"Leveraging our optical solutions know-how with existing manufacturers of semiconductor processing equipment is the best way to bridge the gap caused by the current lag in efficiency that most chip producers face as the high density marketplace moves forward," explains Todd Lizotte, Vice President of R&D at NanoVia, LP.

NanoVia, LP develops, designs and builds automated manufacturing equipment, optical systems and assembly/fabrication processes for the microelectronics packaging, telecom and micro-systems market. NanoVia's core objective is to create intellectual property for licensing and sale to these markets. NanoVia welcomes inquiries about its technologies and system solutions.

For all of NanoVia's most recent news, visit www.3GOPtics.com.

Contact:
Todd Lizotte, Vice President of R&D
NanoVia, LP
4 Delta Drive, Suite 6
Londonderry, NH 03053
P: 603-421-0713
F: 603-421-0214
mailto:telizotte@nanovia.com





This article courtesy of http://www.justpowerdrills.com.
You may freely reprint this article on your website or in
your newsletter provided this courtesy notice and the author
name and URL remain intact.

Submit Your Article